Multilayer ceramic condenser and method of manufacturing the same

ABSTRACT

A multilayer ceramic condenser includes a multilayer main body, a first outer electrode, a second outer electrode, a first side part and a second side part. The multilayer main body has a first side, a second side, a third side and a fourth side. The multilayer main body includes a plurality of inner electrodes and a dielectric layer between the inner electrodes. The dielectric layer is formed by a first ceramic dielectric powder. The first side part and the second side part are formed on the second side and the fourth side of the multilayer main body, and formed by a second ceramic dielectric powder having a smaller particle diameter than the first ceramic dielectric powder. A mean grain size of the first side part or the second side part is similar to or smaller than that of the dielectric layer of the multilayer main body.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.13/194,366, filed Jul. 29, 2011, which claims the priority of KoreanPatent Application No. 10-2010-0128304 filed on Dec. 15, 2010, thedisclosures of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a multilayer ceramic condenser and amethod of manufacturing the same, and more particularly, to a method ofmanufacturing a multilayer ceramic condenser having improved reliabilityby resisting residual stress, and a multilayer ceramic condensermanufactured thereby.

2. Description of the Related Art

A condenser, a device capable of storing electricity, stores electricityin each electrode by applying voltage to opposing electrodes. When DCvoltage is applied to the condenser; however current flows in thecondenser while electricity is stored therein, but when the storage ofelectricity is completed, current does not flow in the condenser.Meanwhile, when AC voltage is applied to the condenser, AC currentcontinuously flows in the condenser while the polarity of the electrodesis alternated.

Depending on the type of an insulator provided between electrodes, thecondenser may be classified as one of an aluminum electrolyticcondenser, in which electrodes are made of aluminum and a thin oxidelayer is provided between the aluminum electrodes, a tantalumelectrolytic condenser using tantalum as an electrode material, aceramic condenser using a high-K dielectric such as barium titanatebetween electrodes, a multi layer ceramic condenser (MLCC) using amultilayer structure made of a high-K ceramic as a dielectric providedbetween electrodes, a film condenser using a polystyrene film as adielectric between electrodes, or the like.

Among these, the multilayer ceramic condenser may be miniaturized whilehaving excellent heat resistance and frequency characteristics, suchthat it has been commonly used for various applications, such as a highfrequency circuit, or the like.

In the multilayer ceramic condenser according to the related art, alaminate may be formed by stacking a plurality of dielectric sheets,external electrodes having different polarities may be formed on theoutside of the laminate, and inner electrodes, alternately stackedwithin the laminate, may be electrically connected to respective outerelectrodes.

The inner electrodes alternately formed between the dielectric sheetsare opposed and paired with one another such that polarity existstherebetween to generate capacitance coupling, such that the multilayerceramic condenser has a capacitance value.

Recently, as electronic products have become miniaturized and highlyintegrated, research into miniaturizing and highly integrating themultilayer ceramic condenser has been conducted. In particular, variousattempts at thinning and highly stacking the dielectric layers in orderto implement the high capacity and miniaturization of the multilayerceramic condenser and optimizing a margin portion of a multilayer mainbody in order to secure an overlap area of an inner electrode have beenconducted.

SUMMARY OF THE INVENTION

An aspect of the present invention provides a method of manufacturing amultilayer ceramic condenser having improved reliability by resistingresidual stress between a multilayer main body and side parts in amultilayer ceramic condenser, and a multilayer ceramic condensermanufactured thereby.

According to an aspect of the present invention, there is providedmultilayer main body, a first outer electrode, a second outer electrode,a first side part and a second side part. The multilayer main body has afirst side, a second side, a third side and a fourth side. Themultilayer main body includes a plurality of inner electrodes and adielectric layer between the inner electrodes. The plurality of innerelectrodes ate exposed to the second side and the fourth side. Thedielectric layer is formed by a first ceramic dielectric powder. Thefirst outer electrode and the second outer electrode are formed on thefirst side and the third side of the multilayer main body. The firstside part and the second side part are formed on the second side and thefourth side of the multilayer main body. The first side part and thesecond side part are formed by a second ceramic dielectric powder havinga smaller particle diameter than the first ceramic dielectric powder.

A particle diameter D90 of the accumulated weight 90% of an accumulatedparticle size distribution of the first ceramic dielectric powder may be50 to 300 nm.

A particle diameter D90 of an accumulated weight 90% of an accumulatedparticle size distribution of the second ceramic dielectric powder maybe 20 to 300 nm.

A Brunauer-Emmett-Teller (“BET”) specific surface area of the secondceramic dielectric powder may be set to be larger by 1 to 50 m²/g thanthat of the first ceramic dielectric powder.

The multilayer main body may further include a first cover layer and asecond cover layer formed on a top surface and a bottom surface thereof.The first cover layer and the second cover layer may be formed by athird ceramic dielectric powder.

A particle diameter of the third ceramic dielectric powder may besimilar to that of the first ceramic dielectric powder.

A sintering temperature of the dielectric layer and the first and secondside parts may be 800 to 1200° C.

A sintering temperature of the first cover layer and the second coverlayer may be 800 to 1200° C.

A particle diameter D90 of an accumulated weight 90% of an accumulatedparticle size distribution of ceramic grains of the dielectric layer andthe first and second side parts are sintered may be 20 to 1000 nm.

A size of a ceramic grain grown from the first ceramic dielectricpowders may be similar to that of a ceramic grain grown from the secondceramic dielectric powders.

A mean grain size of ceramic grains grown from the first ceramicdielectric powders may be similar to or smaller than that of ceramicgrains grown from the second ceramic dielectric powders.

According to another aspect of the present invention, there is provideda multilayer ceramic condenser, including a multilayer main body, afirst outer electrode, a second outer electrode, a first side part and asecond side part. The multilayer main body has a first side, a secondside, a third side and a fourth side. The multilayer main body includesa plurality of inner electrodes and a dielectric layer between the innerelectrodes. The plurality of inner electrodes are exposed to the secondside and the fourth side. The dielectric layer is formed by a firstceramic dielectric powder. The first outer electrode and the secondouter electrode are formed on the first side and the third side of themultilayer main body. The first side part and the second side part areformed on the second side and the fourth side of the multilayer mainbody. A mean grain size of the first side part or the second side partis similar to or smaller than that of the dielectric layer of themultilayer main body.

According to an aspect of the present invention, there is provided amethod of manufacturing a multilayer ceramic condenser, including:forming a plurality of ceramic green sheets using ceramic slurryincluding a ceramic dielectric powder, an organic binder, and an organicsolvent; printing a first inner electrode pattern or a second innerelectrode pattern on the ceramic green sheets; forming a multilayer mainbody sequentially including a first side, a second side, a third side,and a fourth side by stacking the plurality of ceramic green sheets toalternately stack a first inner electrode pattern and a second innerelectrode pattern; and forming a first side part and a second side partby applying a second ceramic slurry including a second ceramicdielectric powder having a smaller particle diameter than that of thefirst ceramic dielectric powder, an organic binder and an organicsolvent to the respective second and fourth sides.

The method of manufacturing a multilayer ceramic condenser may furtherinclude: respectively forming a first cover layer and a second coverlayer formed on the top surface and the bottom surface of the pluralityof dielectric layers and including a third ceramic dielectric powderhaving a particle diameter similar to that of the first ceramicdielectric powder.

The particle diameter D90 of the accumulated weight 90% of theaccumulated particle size distribution of the first ceramic dielectricpowder may be 50 to 300 nm.

The particle diameter D90 of the accumulated weight 90% of theaccumulated particle size distribution of the second ceramic dielectricpowder may be 20 to 300 nm.

A BET specific surface area of the second ceramic dielectric powder maybe set to be larger by 1 to 50 m²/g than that of the first ceramicdielectric powder.

The sintering temperature of the plurality of dielectric layers and thefirst and second side parts may be 800 to 1200° C.

The particle diameter D90 of the accumulated weight 90% of theaccumulated particle size distribution of ceramic grains after theplurality of dielectric layers and the first and second side parts aresintered may be 20 to 1000 nm.

The method of manufacturing a multilayer ceramic condenser may furtherinclude forming a first outer electrode and a second outer electroderespectively connected to a first inner electrode pattern exposed to thefirst side and a second inner electrode pattern exposed to the thirdside.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features and other advantages of thepresent invention will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a perspective view of a multilayer ceramic condenser accordingto an exemplary embodiment of the present invention;

FIG. 2 is an exploded perspective view showing a multilayer main bodyaccording to an exemplary embodiment of the present invention; and

FIG. 3 is a cross-sectional view taken along direction A-A′ of themultilayer ceramic condenser of FIG. 1.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Exemplary embodiments of the present invention will be described withreference to the accompanying drawings. The invention may, however, beembodied in many different forms and should not be construed as beinglimited to the embodiments set forth herein; rather, these embodimentsare provided so that this disclosure will be thorough and complete, andwill fully convey the concept of the invention to those skilled in theart.

Hereinafter, a multilayer ceramic condenser and a method ofmanufacturing the same according to an exemplary embodiment of thepresent invention will be described with reference to FIGS. 1 to 3.

FIG. 1 is a perspective view of a multilayer ceramic condenser accordingto an exemplary embodiment of the present invention, FIG. 2 is anexploded perspective view showing a multilayer main body according to anexemplary embodiment of the present invention, and FIG. 3 is across-sectional view taken along direction A-A′ of the multilayerceramic condenser of FIG. 1.

Referring to FIG. 1, a multilayer ceramic condenser according to anexemplary embodiment of the present invention may be configured toinclude a multilayer main body 20 and a first outer electrode 10 a and asecond outer electrode 10 b formed at both ends of the multilayer mainbody 20.

The multilayer main body 20 is formed by stacking a plurality ofdielectric layers 200 and includes a first side, a second side, a thirdside, and a fourth side. The first side and the third side are formed toface each other and the second side and the fourth side are also formedto face each other.

The multilayer main body 20 may include a plurality of dielectric layers200 and first inner electrode patterns 30 a and second inner electrodepatterns 30 b formed between the plurality of dielectric layers 200 tobe exposed to the first side and the third side. The first innerelectrode pattern 30 a and the second inner electrode pattern 30 b arealternately stacked, having at least one dielectric layer 200 disposedtherebetween.

The first inner electrode pattern 30 a and the second inner electrodepattern 30 b are formed to be exposed to the first side and the thirdside, respectively, and the first side and the third side areindividually provided with the first outer electrode 10 a and the secondouter electrode lob, such that the first inner electrode pattern 30 a orthe second inner electrode pattern 30 b may respectively be electricallyconnected to the first outer electrode 10 a and the second outerelectrode 10 b.

The plurality of dielectric layers 200 forming the multilayer main body20 may be formed of a high-k ceramic green sheet, which is in turnsubjected to a stacking process and a firing process to form themultilayer main body 20 having the plurality of stacked dielectriclayers 200.

The first outer electrode 10 a and the second outer electrode 10 b maybe made of materials having excellent electrical conductivity, and mayserve to electrically connect the first inner electrode pattern 30 a,the second inner electrode pattern 30 b, or other various patternsformed in the multilayer ceramic condenser to external devices.

The first outer electrode 10 a and the second outer electrode 10 b arenot limited thereto, but may be made of materials having excellentelectrical conductivity such as Ni, Ag, Pd, or the like.

According to the exemplary embodiment of the present invention, a marginportion may be formed on the side of the multilayer main body to securethe durability of the multilayer main body and improve the reliabilityof chips.

The multilayer main body may be formed by manufacturing a first ceramicslurry including a first ceramic dielectric powder, an organic binder,and an organic solvent, manufacturing a plurality of ceramic greensheets by applying the first ceramic slurry to a substrate, and stackingthe manufactured ceramic green sheets.

Meanwhile, in order to form the margin portion, a method ofmanufacturing a second ceramic slurry including a second ceramicdielectric powder, an organic binder, and an organic solvent and dippingthe multilayer main body in the second ceramic slurry may be used.

In this case, the ceramic slurry forming the margin portion needs tohave appropriate strength and densification so as to be simultaneouslyfired to that of the ceramic slurry forming the ceramic green sheetsthat is configured as the multilayer main body.

However, when the first ceramic dielectric powder and the second ceramicdielectric powder have an approximately equal particle diameter, theintervals between particles are densified by the stacking andcompressing processes in the first ceramic dielectric powder torelatively lower the sintering temperature, thereby causing thephenomenon that the sintering temperature of the multilayer main bodyincluding the first ceramic dielectric powder is lower.

Therefore, when the margin portion is formed in the multilayer main bodyand a simultaneous firing process is applied thereto, the margin portionis non-fired in order to generate the residual stress between the marginportion and the multilayer main body, thereby causing cracks.

However, according to the exemplary embodiment of the present invention,the particle diameter of the second ceramic dielectric powder formingthe margin portion is different from the particle diameter of the firstceramic dielectric powder, such that simultaneous sintering may beachieved.

Further, the sintering characteristics may be more improved by forming afirst side part and a second side part on only the second side and thefourth side without forming the margin portion over the entire surfaceof the multilayer main body and by optimizing the thicknesses of theside parts thereof.

As the multilayer main body and the margin portion are firedsimultaneously, residual stress occurs between the multilayer main bodyand the margin portion, thereby preventing cracks from being formedtherein.

Hereinafter, a method of manufacturing a multilayer ceramic condenseraccording to an exemplary embodiment of the present invention will bedescribed with reference to FIGS. 2 to 3.

A method of manufacturing a multilayer ceramic condenser according to anexemplary embodiment of the present invention includes: forming aplurality of ceramic green sheets using ceramic slurry including a firstceramic dielectric powder, an organic binder, and an organic solvent;printing a first inner electrode pattern 30 a or a second innerelectrode pattern on the ceramic green sheets; forming a multilayer mainbody 20 sequentially including a first side, a second side, a thirdside, and a fourth side by stacking the plurality of ceramic greensheets to alternately stack the first inner electrode pattern 30 a andthe second inner electrode pattern 30 b; and forming the first side part150 a and the second side part 150 b by covering the respective secondand fourth sides with a second ceramic slurry including a second ceramicdielectric powder having a smaller particle diameter than that of thefirst ceramic dielectric powder, an organic binder and an organicsolvent.

Referring to FIG. 2 showing the multilayer ceramic condenser accordingto the exemplary embodiment of the present invention, a plurality ofceramic green sheets 201 and 202 are prepared in order to manufacturethe multilayer ceramic condenser according to the exemplary embodimentof the present invention.

The plurality of ceramic green sheets 201 and 202 may be formed byapplying the first ceramic slurry including the first ceramic dielectricpowder, the organic binder, and the organic solvent to the substrate asa carrier film.

The first ceramic dielectric powder may be made of a high-K material. Itis not limited but a barium titanate-based material, a lead complexPerovskite-based material, a strontium titanate-based material, or thelike, may be used, preferably, a barium titanate powder may be used.

The organic binder for securing the dispersibility and viscosity of theultra fine ceramic dielectric powder may be used to control theviscosity of the ceramic slurry by controlling the amount thereof. Aresin may be used as the organic binder and is not limited, but a resinsuch as ethyl cellulose, polyvinyl butyral, or the like, may be used.

The first inner electrode pattern 30 a and the second inner electrodepattern 30 b exposed to different surfaces may be printed on theplurality of ceramic green sheets 201 and 202.

Therefore, the plurality of first ceramic green sheets 201 printed withthe first inner electrode pattern 30 a may be manufactured, and theplurality of second ceramic green sheets 202 printed with the secondinner electrode pattern 30 b may be manufactured.

The plurality of first ceramic green sheets 201 and the plurality ofsecond ceramic green sheets 202 are alternately stacked to form themultilayer main body 20. The multilayer main body 20 includes the firstside, the second side, the third side, and the fourth side.

The first inner electrode pattern 30 a may be formed to be exposed tothe first side of the multilayer main body 20 and the second innerelectrode pattern 30 b may be formed to be exposed to the third side ofthe multilayer main body 29.

The first inner electrode pattern 30 a and the second inner electrodepattern 30 b may be made of a conductive metal having excellentelectrical conductivity, and it is not limited but the first innerelectrode pattern 30 a and the second inner electrode pattern 30 b mayinclude at least one selected from a group consisting of Ag, Ni, Cu, Pd,and an alloy thereof.

According to the exemplary embodiment of the present invention, themultilayer main body 20 may include a first cover layer 100 a stacked onthe uppermost surface thereof and a second cover layer 100 b stacked onthe lowest surface thereof.

The first cover layer 100 a and the second cover layer 100 b arerespectively stacked on the uppermost surface and the lowest surface ofthe multilayer main body to protect the plurality of first ceramic greensheets and the plurality of second ceramic green sheets stacked in themultilayer main body 20 from a physical and chemical stress from theoutside.

The first cover layer 100 a and the second cover layer 100 b may beformed by applying a third ceramic slurry including a third ceramicdielectric powder, an organic binder, and an organic solvent to thesubstrate such as the carrier film.

The third ceramic dielectric powder may have a particle diameter similarto that of the first ceramic dielectric powder.

In order to simultaneously fire the plurality of first ceramic greensheets 201, the plurality of second ceramic green sheets 202, the firstcover layer 100 a and the second cover layer 100 b in firing themultilayer main body 20, the third ceramic dielectric powder may bemanufactured to have an approximately equal particle diameter to that ofthe first ceramic dielectric powder.

According to the exemplary embodiment of the present invention, themultilayer main body 20 may be formed by stacking and compressing theplurality of dielectric layers 200 including the first ceramicdielectric powder and the first and second cover layers 100 a and 100 bincluding the third ceramic dielectric powder, wherein the first ceramicdielectric powder and the third ceramic dielectric powder have a similarparticle size and thus, may be simultaneously fired.

In addition, in the multilayer main body 20 according to the exemplaryembodiment of the present invention, the inner electrode patterns areprovided to cover the overall area other than a minimum area of theplurality of dielectric layers 200 required to maintain the insulationof the plurality of dielectric layers, such that the inner electrodepatterns can secure a maximum area in the multilayer main body 20 inorder to secure capacitance within the multilayer ceramic condenser.

In the case of the multilayer ceramic condenser, the capacitance of themultilayer ceramic condenser may be secured according to an overlap areaof the first inner electrode pattern 30 a and the second inner electrodepattern 30 b. According to the exemplary embodiment of the presentinvention, the overlap area of the first inner electrode pattern 30 aand the second inner electrode pattern 30 b may be substantiallyincreased. Therefore, the high-capacity multilayer ceramic condenser maybe implemented.

According to the exemplary embodiment of the present invention, thesecond side and the third side of the multilayer main body 20 mayrespectively be provided with a first side part 150 a and a second sidepart 150 b.

The first inner electrode pattern 30 a and the second inner electrodepattern 30 b are respectively formed to be exposed to the first side andthe third side and to cover the dielectric layer 200, such that both thefirst and second inner electrode patterns 30 a and 30 b may be exposedto all of the first side, the second side, the third side, and thefourth side.

Therefore, when the first and second inner electrode patterns 30 a and30 b are manufactured in a chip form, these electrode patterns may beexposed to the outside, such that they are damaged by the physical andchemical stress, thereby causing defects to the first and second innerelectrode patterns 30 a and 30 b.

The top surface and the bottom surface of the multilayer main body 20are provided with the first cover layer 100 a and the second cover layer100 b, such that the first and second inner electrode patterns 30 a and30 b can be protected. Further, the first side and the third side of themultilayer main body 20 are provided with the first outer electrode andthe second outer electrode, such that the first and second innerelectrode patterns 30 a and 30 b formed therein can be protected.

In the related art, when the first and second inner electrode patternsare printed in the dielectric layer, the first and second innerelectrode patterns are not exposed to the second side and the fourthside. Therefore, the first and second inner electrode patterns can beprotected from the external stress without forming a separate margin.

However, according to the exemplary embodiment of the present invention,the first and second inner electrode patterns are printed to cover thedielectric layers 200, such that the first and second inner electrodepatterns 30 a and 30 b are exposed to the second side and the fourthside.

According to the exemplary embodiment of the present invention, thesecond side and the fourth side may respectively be provided with thefirst side part 150 a and the second side part 150 b.

The first side part 150 a and the second side part 150 b are formed byselectively applying the slurry to only the second side and the fourthside and thus, the thickness of the first cover layer 100 a and thesecond cover layer 100 b may not be affected.

The exemplary embodiment of the present invention may use a method ofselectively applying a slurry to only the second side and the fourthside. That is, it is not limited but the first side part 150 a and thesecond side part 150 b may be formed by applying the slurry to only thesecond side and the fourth side by using the method that films areremovably attached to all of the surfaces of the multilayer main body 20other than the second side and the fourth side thereof, and then, dip inthe slurry and the attached films are removed.

The first side part 150 a and the second side part 150 b may be formedto be covered with the second ceramic slurry. The second ceramic slurrymay include a second ceramic dielectric powder, an organic binder, andan organic solvent.

The organic binder and the organic solvent may be used to disperse thesecond ceramic dielectric powder in the second ceramic slurry. Inparticular, as the organic binder, a resin such as ethyl cellulose,polyvinyl butyral, or the like, may be used, but is not limited thereto.

The second ceramic dielectric powder may be made of the same material asthe first ceramic dielectric powder, as a high-K material. The materialused for the second ceramic dielectric powder may be a lead complexPerovskite-based material, a strontium titanate-based material, or thelike, preferably, may be a barium titanate powder, but is not limitedthereto.

According to the exemplary embodiment of the present invention, theparticle diameter of the second ceramic dielectric powder may be set tobe smaller than that of the first ceramic dielectric powder.

When the particle diameter of the first ceramic dielectric powder issimilar to that of the second ceramic dielectric powder, the dielectriclayer including the first ceramic dielectric powder is sintered at alower temperature than that of the first and second side parts includingthe second ceramic dielectric powder.

The dielectric layer has the densification of the ceramic dielectricpowder by the stacking and compressing processes, such that thedielectric layer may be sintered at a relatively lower temperature.

When the dielectric layer is different from the first and second sideparts in terms of the sintering temperature, the first and second sideparts are non-sintered during a simultaneous firing process after thefirst and second side parts are formed in the multilayer main body 20.

Therefore, the residual stress may occur between the dielectric layerand the first and second side parts, such that the cracks or thedeformation may occur between the dielectric layer and the first andsecond side parts.

According to the exemplary embodiment of the present invention, theparticle diameter of the second ceramic dielectric powder may be smallerthan that of the first ceramic dielectric powder in order to match thesintering temperature of the dielectric layer 200 with that of the sideparts.

The particle diameter D90 of the accumulated weight 90% of theaccumulated particle size distribution of the first ceramic dielectricpowder may be 50 to 300 nm. The particle diameter D90 of the accumulatedweight 90% of the accumulated particle size distribution of the secondceramic dielectric powder may be 20 to 300 nm.

In more detail, a Brunauer-Emmett-Teller (“BET”) specific surface areaof the second ceramic dielectric powder may be set to be larger by 1 to50 m²/g than that of the first ceramic dielectric powder.

When a difference between the BET specific surface areas of the secondceramic dielectric powder and the first ceramic dielectric powder isbelow 1 m²/g, the first and second side parts may be non-sintered.

In addition, when the difference between the BET specific surface areasof the second ceramic dielectric powder and the first ceramic dielectricpowder exceeds 50 m²/g, the contraction ratio of the first and secondside parts becomes excessively large during a firing process, such thatthe cracks or the deformation may occur due to the difference of thecontraction ratios between the dielectric layer and the first and secondside parts.

In particular, the phenomenon that the inner electrode of the multilayermain body is diffused to the outer electrode during the firing processmay occur. In this case, when the first and second parts are excessivelycontracted, the cracks may occur by the diffusion force of the innerelectrode between the first and second side parts and the multilayermain body and the contraction force affecting the first and second sideparts.

Therefore, the difference between the BET specific surface areas of thesecond ceramic dielectric powder and the first ceramic dielectric powdermay be 1 to 50 m²/g.

According to the exemplary embodiment of the present invention, thesintering temperature of the plurality of dielectric layers 200including the first ceramic dielectric powder may be similar to that ofthe first and second side parts 150 a and 150 b including the secondceramic dielectric powder.

According to the exemplary embodiment of the present invention, thesintering temperature of the plurality of dielectric layers 200 and thefirst side part 150 a and the second side part 150 b may be 800 to 1200°C.

The sintering temperature of the plurality of dielectric layers 200 maybe similar to that of the first and second side parts 150 a and 150 b,such that the multilayer main body 20 and the first and second sideparts 150 a and 150 b may be simultaneously fired. Therefore, thephenomenon that the multilayer main body 20 and the first and secondparts 150 a and 150 b are partially fired during the firing process maybe prevented.

According to the exemplary embodiment of the present invention, themultilayer main body 20 includes the plurality of dielectric layers 200and the first cover layer 100 a and the second cover layer 100 brespectively formed on the top surface and the bottom surface of thedielectric layer 200. The first and second cover layers 100 a and 100 binclude the third ceramic dielectric powder having a particle diametersimilar to a particle diameter of the first ceramic dielectric powderincluded in the plurality of dielectric layers 200.

Therefore, the plurality of dielectric layers 200 and the first andsecond cover layers 100 a and 100 b may be sintered at an approximatelyequal temperature, such that the sintering temperature of the first andsecond cover layers 100 a and 100 b may be 800 to 1200° C.

When the multilayer main body 20 and the first and second side parts 150a and 150 b are sintered, the organic binder and the organic solventincluded therein may be completely evaporated and the ceramic powdersare densified to grow to ceramic grains.

According to the exemplary embodiment of the present invention, thegrain diameter D90 of the accumulated weight 90% of the accumulatedgrain size distribution of the ceramic grains after sintering the firstceramic dielectric powder forming the dielectric layer 200 and thesecond ceramic dielectric powder forming the first and second side parts150 a and 150 b may be 20 to 1000 nm.

According to the exemplary embodiment of the present invention, theparticle diameter of the second ceramic dielectric powder is smallerthan that of the first ceramic dielectric powder or the BET specificsurface area of the second ceramic dielectric powder is larger than thatof the first ceramic dielectric powder. Accordingly, a mean grain sizeof the first and second side parts 150 a and 150 b may be similar to orsmaller than that of the dielectric layer 200. The mean grain size ofthe first and second side parts 150 a and 150 b may be controlled bycontrolling the size or the BET specific surface area of the secondceramic dielectric powder. In one embodiment of the present invention,the mean grain size of the first and second side parts 150 a and 150 bmay be smaller than that of the dielectric layer 200. In anotherembodiment of the present invention, the mean grain size of the firstand second side parts 150 a and 150 b may be similar to that of thedielectric layer 200.

In one exemplary embodiment of the present invention, since the firstceramic dielectric powder forming the dielectric layer 200 and the thirdceramic dielectric powder forming the first and second cover layers 100a and 100 b are appropriately densified by the stacking and compressingprocesses, the mean grain size of the first and second side parts 150 aand 150 b may be similar to that of the dielectric layer 200. Inparticular, when the difference between the BET specific surface areasof the first ceramic dielectric powder and the second ceramic dielectricpowder is 1 to 50 m²/g, the mean grain size of the first and second sideparts 150 a and 150 b may be similar to that of the dielectric layer200.

That is, according to the exemplary embodiment of the present invention,the grain size of the first and second side parts 150 a and 150 b may becontrolled by controlling the particle size or the BET specific surfacearea of the second ceramic dielectric powder, such that the occurrenceof the residual stress between the multilayer main body 20 and the firstand second side parts 150 a and 150 b may be prevented.

Consequently, it is possible to prevent the cracks and the deformationof the multilayer main body 20 and the first and second side parts 150 aand 150 b from occurring by resisting the residual stress during thesintering process of the multilayer main body 20 and the first andsecond side parts 150 a and 150 b. Further, the multilayer main body 20and the first and second side parts 150 a and 150 b may be integrated inthe completed multilayer ceramic condenser, such that the durability ofthe multilayer ceramic condenser is increased.

Referring to FIGS. 1 and 3, the multilayer ceramic condenser accordingto the exemplary embodiment of the present invention may be configuredto include: the multilayer main body 20 in which the plurality ofdielectric layers 200 formed by applying the first ceramic slurryincluding the first ceramic dielectric powder, the organic binder, andthe organic solvent are stacked and sequentially surrounded by the firstside, the second side, the third side, and the fourth side; the firstinner electrode pattern 30 a and the second inner electrode pattern 30 bformed between the plurality of dielectric layers 200 and formed to beexposed to the first side and the third side opposing to each other inthe multilayer main body 20; and the first side part 150 a and thesecond side part 150 b respectively formed on the second side and thefourth side of the multilayer main body 20, and formed by applying thesecond ceramic slurry including the second ceramic dielectric powderhaving a smaller particle diameter than the first ceramic dielectricpowder, the organic binder, and the organic solvent thereto.

According to the exemplary embodiment of the present invention, in orderto match the sintering temperature of the plurality of dielectric layers200 including the first ceramic dielectric powder with that of the firstand second side parts 150 a and 150 b including the second ceramicdielectric powder, the particle diameter of the second ceramicdielectric powder may be smaller than that of the first ceramicdielectric powder.

In more detail, the particle diameter D90 of the accumulated weight 90%of the accumulated particle size distribution of the first ceramicdielectric powder may be 50 to 300 nm. The particle diameter D90 of theaccumulated weight 90% of the accumulated particle size distribution ofthe second ceramic dielectric powder may be 20 to 300 nm.

In other words, the BET specific surface area of the second ceramicdielectric powder may be set to be larger by 1 to 50 m²/g than that ofthe first ceramic dielectric powder.

Therefore, the plurality of dielectric layers 200 and the first andsecond side parts 150 and 150 b that are subjected to the stacking andcompressing processes may be simultaneously fired, and the occurrence ofthe residual stress between the plurality of dielectric layers 200 andthe first and second side parts 150 a and 150 b during the firingprocess may be prevented.

According to the exemplary embodiment of the present invention, thefirst cover layer 100 a and the second cover layer 100 b stacked on thetop surface and the bottom surface of the plurality of dielectric layers200 and including the third ceramic dielectric powder may be provided.

Therefore, the plurality of dielectric layer 200 may be protected fromthe external stress.

The first and second cover layers 100 a and 100 b may have an particlediameter similar to that of the first ceramic dielectric powder. Thefirst and second cover layers 100 a and 100 b and the plurality ofdielectric layers 200 are subjected to the stacking and compressingprocesses, such that they may have an approximately equal sinteringtemperature even though they include the third ceramic dielectric powderhaving a particle diameter similar to that of the first ceramicdielectric powder.

According to the exemplary embodiment of the present invention, thesintering temperature of the plurality of dielectric layers 200 and thefirst side part 150 a and the second side part 150 a and 150 b may be800 to 1200° C.

Further, the sintering temperature of the first cover layer 100 a andthe second cover layer 100 b may be 800 to 1200° C.

According to the exemplary embodiment of the present invention, thefirst ceramic dielectric powder and the second ceramic dielectric powderare selected to have an appropriate size, such that they may have anapproximately equal sintering temperature. As a result, the non-sinteredcomponents are not present even though the plurality of dielectriclayers 200 and the first and second side parts 150 a and 150 b aresimultaneously fired.

According to the exemplary embodiment of the present invention, afterthe organic binder and the organic solvent are removed by the firingprocess, the ceramic slurries are grown to ceramic grains having anapproximately equal size.

After the plurality of dielectric layers 200 and the first side part 150a and the second side part 150 b are sintered, the particle diameter D90of the accumulated weight 90% of the accumulated particle sizedistribution of the ceramic grains may be 20 to 1000 nm.

According to the exemplary embodiment of the present invention, eventhough the particle diameter of the first ceramic dielectric powder islarger than that of the second ceramic dielectric powder, the firstceramic dielectric powders are densified by the stacking and compressingprocesses, such that the ceramic grains grown from the first ceramicdielectric powders after being subjected to the firing process have thesize similar to that of the ceramic grains grown from the second ceramicdielectric powders.

Therefore, the plurality of dielectric layers 200 configured as themultilayer main body 20, the first and second cover layers 100 a and 100b, and the first and second side parts 150 a and 150 b attached to themultilayer main body 20 may be integrated, such that they have arelatively strong durability against the external stress involved inuse.

According to the exemplary embodiment of the present invention, theinner electrode patterns capable of securing maximum overlap areas canbe printed in the plurality of dielectric layers 200. Therefore, thehigh-capacity multilayer ceramic condenser can be implemented.

According to the exemplary embodiment of the present invention, thefirst and second side parts 150 a and 150 b having a sinteringtemperature similar to that of the multilayer main body 20 are formed inthe multilayer main body 20, such that the first and second side parts150 a and 150 b can be sintered simultaneously to the multilayer mainbody 20. Therefore, it is possible to prevent the cracks and deformationof the products by resisting the residual stress in the multilayer mainbody 20 and the first and second side parts 150 a and 150 b during thefiring process.

In addition, according to the exemplary embodiment of the presentinvention, a mean grain size of the first and second side parts 150 aand 150 b may be controlled by controlling the particle size or the BETspecific surface area of the second ceramic dielectric powder. The meangrain size of the first and second side parts 150 a and 150 b may besimilar to or smaller than that of the dielectric layer 200. Inparticular, when the mean grain size of the first and second side parts150 a and 150 b is similar to that of the multilayer main body 20, themultilayer main body 20 and the first and second side parts 150 a and150 b can be integrated, such that the durability of the multilayerceramic condenser can be secured.

As set forth above, according to the exemplary embodiment of the presentinvention, the residual stress between the multilayer main body 20 inwhich the plurality of dielectric layers 200 of the multilayer ceramiccondenser are stacked and the side parts 150 a and 150 b formed on thesides of the multilayer main body 20 may be prevented.

Therefore, according to the exemplary embodiment of the presentinvention, cracks between the side parts 150 a and 150 b and themultilayer main body 20 or the deformation of chips during the firingprocess may be prevented. Accordingly, the multilayer ceramic condenserhaving the improved reliability may be manufactured.

While the present invention has been shown and described in connectionwith the exemplary embodiments, it will be apparent to those skilled inthe art that modifications and variations can be made without departingfrom the spirit and scope of the invention as defined by the appendedclaims.

What is claimed is:
 1. A multilayer ceramic condenser, comprising: amultilayer main body formed by stacking a plurality of dielectric layersincluding ceramic grains formed from sintering a first ceramicdielectric powder and sequentially surrounded by a first side, a secondside, a third side, and a fourth side; a first inner electrode patternand a second inner electrode pattern formed on the plurality ofdielectric layers and formed to be exposed to the first side and thethird side of the multilayer main body, respectively; a first externalelectrode formed on the first side of the multilayer main body and asecond external electrode formed on the second side of the multilayermain body; and a first side part and a second side part each formed onthe second side and the fourth side of the multilayer main body, andincluding ceramic grains formed from sintering a second ceramicdielectric powder having a smaller particle diameter than the firstceramic dielectric powder, wherein a mean grain size of the ceramicgrains formed from sintering a first ceramic dielectric powder and amean grain size of the ceramic grains formed from sintering a secondceramic dielectric powder are similar.
 2. The multilayer ceramiccondenser of claim 1, wherein the multilayer main body, the first andsecond side part are simultaneously sintered.
 3. The multilayer ceramiccondenser of claim 1, wherein a particle diameter D90 of an accumulatedweight 90% of an accumulated particle size distribution of the firstceramic dielectric powder is 50 to 300 nm.
 4. The multilayer ceramiccondenser of claim 1, wherein a particle diameter D90 of an accumulatedweight 90% of an accumulated particle size distribution of the secondceramic dielectric powder is 20 to 300 nm.
 5. The multilayer ceramiccondenser of claim 1, wherein a Brunauer-Emmett-Teller (“BET”) specificsurface area of the second ceramic dielectric powder is set to be largerby 1 to 50 m2/g than that of the first ceramic dielectric powder.
 6. Themultilayer ceramic condenser of claim 1, wherein the multilayer mainbody further includes a first cover layer and a second cover layerformed on a top surface and a bottom surface thereof, the first coverlayer and the second cover layer being formed by a third ceramicdielectric powder.
 7. The multilayer ceramic condenser of claim 6,wherein a particle diameter of the third ceramic dielectric powder issimilar to that of the first ceramic dielectric powder.
 8. Themultilayer ceramic condenser of claim 1, wherein a sintering temperatureof the dielectric layer and the side part is 800 to 1200° C.
 9. Themultilayer ceramic condenser of claim 6, wherein a sintering temperatureof the first cover layer and the second cover layer is 800 to 1200° C.10. The multilayer ceramic condenser of claim 1, wherein the particlediameter D90 of the accumulated weight 90% of the accumulated particlesize distribution of the ceramic grains after the plurality ofdielectric layers and the first and second side parts are sintered is 20to 1000 μm.